NSN 5310-14-350-3097, 5310143503097
RONDELLE,PLATE

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OPERATING TEMP RANGE: (AFGA) -40.0 TO 85.0 DEG CELSIUS
STORAGE TEMP RANGE: (AFJQ) -65.0/+150.0 DEG CELSIUS
BODY HEIGHT: (ADAU) 0.180 INCHES MAXIMUM
BODY LENGTH: (ADAQ) 0.870 INCHES MAXIMUM
BODY WIDTH: (ADAT) 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM
DESIGN FUNCTION AND QUANTITY: (CSSL) 6 BUFFER
FEATURES PROVIDED: (CBBL) LOW POWER AND W/RESISTOR AND POSITIVE OUTPUTS
INCLOSURE CONFIGURATION: (CQSZ) DUAL-IN-LINE
INCLOSURE MATERIAL: (CQSJ) PLASTIC
INPUT CIRCUIT PATTERN: (CQZP) HEX 1 INPUT
OPERATING TEMP RANGE: (AFGA) -40.0 TO 85.0 CELSIUS
OUTPUT LOGIC FORM: (CQWX) COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
STORAGE TEMP RANGE: (AFJQ) -65.0 TO 150.0 CELSIUS
TERMINAL SURFACE TREATMENT: (CWSG) SOLDER
TERMINAL TYPE AND QUANTITY: (TTQY) 16 PRINTED CIRCUIT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: (CZEN) -0.5 VOLTS MINIMUM POWER SOURCE AND 18.0 VOLTS MAXIMUM POWER SOURCE
STORAGE TEMP RANGE: (AFJQ) -65.0 TO 150.0 DEG CELSIUS
OPERATING TEMP RANGE: (AFGA) -40.0/+85.0 DEG CELSIUS