NSN 5840-15-103-3300, 5840151033300
ELECTRONIC COMPONEN

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INTERNAL CONFIGURATION: (ALAS) JUNCTION CONTACT
MATERIAL: (MATT) PLASTIC ENCLOSURE
MOUNTING METHOD: (AXGY) TERMINAL
OVERALL DIAMETER: (ADAV) 0.170 INCHES NOMINAL
OVERALL HEIGHT: (ABKW) 0.145 INCHES NOMINAL
OVERALL LENGTH: (ABHP) 0.185 INCHES NOMINAL
POWER RATING PER CHARACTERISTIC: (CTRD) 0.3 WATTS MAXIMUM TOTAL DEVICE DISSIPATION
SEMICONDUCTOR MATERIAL: (CTMZ) SILICON
SPECIAL FEATURES: (FEAT) JUNCTION PATTERN ARRANGEMENT: NPN
TERMINAL CIRCLE DIAMETER: (AYQS) 0.135 INCHES MINIMUM
TERMINAL LENGTH: (ABJT) 0.500 INCHES MINIMUM
TERMINAL TYPE AND QUANTITY: (TTQY) 3 UNINSULATED WIRE LEAD
MATERIAL: (MATT) PLASTIC INCLOSURE
III SEMICONDUCTOR MATERIAL: (CTMZ) SILICON
POWER RATING PER CHARACTERISTIC: (CTRD) 0.3 WATTS SMALL-SIGNAL INPUT POWER, COMMON-COLLECTOR ABSOLUTE
INCLOSURE MATERIAL: (ABBH) PLASTIC
UNABLE TO DECODE: (ABBH) UNABLE TO DECODE