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NSN 5961-00-028-1125, 5961000281125
TRANSISTOR

Federal Supply Classification
FSC 5961 - Semiconductor Devices and Associated Hardware
National Item Identification Number
NIIN 000281125
Codification Country
United States
Item Name Code
INC 20588
Criticality
(X) This item does not have a nuclear hardened feature or any other critical feature such as tolerance, fit restriction or application.
Hazardous Material Indicator Code
(N) There is no data in the HMIRS and the NSN is in an FSC not generally suspected of containing hazardous materials.
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DLMS® Summary

National Stock Number 5961-00-028-1125

National Stock Number (NSN) 5961-00-028-1125, or NIIN 000281125, (transistor) was assigned October 17, 1972 in the Federal Logistics Information System (FLIS). NIIN 000281125 was cancelled on January 10, 2017, with a cancelled status of "Item is Cancelled - USE." This NSN was replaced by NSN 5961001332983. This NSN does not replace any other NSNs.

There are 2 manufacturer part numbers associated with this NSN. None of the associated part number(s) are considered obsolete. The manufacturer part numbers were originally supplied by one supplier. Today, one supplier is listed as an Active supplier for this NSN. Of the active suppliers, only one supplier is deemed design controlled or valid supply parts.

This part number has not been procured by the US Government in over 5 years.

This NSN is assigned to Item Name Code (INC) 20588. [AN ACTIVE SEMICONDUCTOR DEVICE WITH THREE OR MORE ELECTRODES. MAY OR MAY NOT INCLUDE MOUNTING HARDWARE AND/OR HEATSINK. EXCLUDES:SEMICONDUCTOR DEVICE, DIODE AND SEMICONDUCTOR DEVICE, THYRISTOR. FOR SOLID STATE DEVICES WHICH ARE RESPONSIVE TO VISIBLE OR INFRARED RADIANT ENERGY, SEE SEMICONDUCTOR DEVICE, PHOTO.]. This item does not have a nuclear hardened feature or any other critical feature such as tolerance, fit restriction or application. There is no data in the HMIRS and the NSN is in an FSC not generally suspected of containing hazardous materials. NSN 5961000281125 contains an unknown precious metal.

This information was last updated on .


Technical Characteristics

III SEMICONDUCTOR MATERIAL
(CTMZ) SILICON
OVERALL LENGTH
(ABHP) 0.210 INCHES MAXIMUM
TERMINAL LENGTH
(ABJT) 0.500 INCHES MINIMUM
INTERNAL CONFIGURATION
(ALAS) JUNCTION CONTACT
INTERNAL JUNCTION CONFIGURATION
(ASCQ) NPN
FEATURES PROVIDED
(CBBL) HERMETICALLY SEALED CASE
POWER RATING PER CHARACTERISTIC
(CTRD) 200.0 MILLIWATTS SMALL-SIGNAL INPUT POWER, COMMON-COLLECTOR MINIMUM
OVERALL HEIGHT
(ABKW) 0.210 INCHES NOMINAL
CURRENT RATING PER CHARACTERISTIC
(CTQX) 40.00 MILLIAMPERES SOURCE CUTOFF CURRENT MAXIMUM
MOUNTING METHOD
(AXGY) TERMINAL
TERMINAL TYPE AND QUANTITY
(TTQY) 4 UNINSULATED WIRE LEAD
INCLOSURE MATERIAL
(ABBH) METAL
CURRENT RATING PER CHARACTERISTIC
(CTQX) 40.00 MILLIAMPERES MAXIMUM COLLECTOR CURRENT, DC
OVERALL DIAMETER
(ADAV) 0.230 INCHES MAXIMUM
VOLTAGE RATING IN VOLTS PER CHARACTERISTIC
(CTQN) 30.0 MAXIMUM BREAKDOWN VOLTAGE, COLLECTOR-TO-BASE, EMITTER OPEN AND 15.0 MAXIMUM BREAKDOWN VOLTAGE, COLLECTOR-TO-EMITTER, BASE OPEN
SEMICONDUCTOR MATERIAL
(CTMZ) SILICON

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