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NSN 5961-01-062-2838, 5961010622838
SEMICONDUCTOR DEVICE,PHOTO

Federal Supply Classification
FSC 5961 - Semiconductor Devices and Associated Hardware
National Item Identification Number
NIIN 010622838
Codification Country
United States
Item Name Code
INC 20587
Criticality
(X) This item does not have a nuclear hardened feature or any other critical feature such as tolerance, fit restriction or application.
Hazardous Material Indicator Code
(N) There is no data in the HMIRS and the NSN is in an FSC not generally suspected of containing hazardous materials.
Availability: Readily Available Qualified Suppliers: Currently qualifying suppliers

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DLMS® Summary

National Stock Number 5961-01-062-2838

National Stock Number (NSN) 5961-01-062-2838, or NIIN 010622838, (semiconductor device,photo) was assigned July 13, 1978 in the Federal Logistics Information System (FLIS). This NIIN is Available for Manual Assignment. This NSN does not replace any other NSNs.

There are 4 manufacturer part numbers associated with this NSN. 2 of those part number(s) are considered obsolete. The manufacturer part numbers were originally supplied by 3 suppliers. Today, 3 suppliers are listed as Active suppliers for this NSN. Of the active suppliers, 3 suppliers are deemed design controlled or valid supply parts.

This part number has not been procured by the US Government in over 5 years.

This NSN is unique to one weapons system.

Based on a planned procurement review by the Primary Inventory Control Activity (PICA) on Aug 02, 2006, this NSN's acquisition method was noted as: Acquire directly from the actual manufacturer, whether or not the prime contractor is the actual manufacturer. This part requires engineering source approval by the design control activity in order to maintain the quality of the part. An alternate source must qualify in accordance with the design control activity's procedures, as approved by the cognizant Government engineering activity. Valid AMCs: 1, 2, 3, 4 and 5.

This NSN is assigned to Item Name Code (INC) 20587. [A SEMICONDUCTOR DEVICE (1) WHICH IS RESPONSIVE TO VISIBLE OR INFRARED RADIANT ENERGY. MAY OR MAY NOT INCLUDE MOUNTING HARDWARE AND/OR HEAT SINK. EXCLUDES:SEMICONDUCTOR DEVICE (1), DIODE; SEMICONDUCTOR DEVICE (1), THYRISTOR AND TRANSISTOR. FOR SOLID STATE DEVICES WHICH EMIT VISIBLE OR INFRARED RADIANT ENERGY, SEE LIGHT EMITTING DIODE.]. This item does not have a nuclear hardened feature or any other critical feature such as tolerance, fit restriction or application. There is no data in the HMIRS and the NSN is in an FSC not generally suspected of containing hazardous materials. NSN 5961010622838 does not contain precious metals.

This NSN is associated to Schedule B 8541409500: photosensitive semiconductor devices, nesoi. The Schedule B End Use is listed as semiconductors. NAICS classification category 334413: semiconductor and related device manufacturing.

This information was last updated on .


Technical Characteristics

FUNCTION FOR WHICH DESIGNED
(AFZC) PHOTODIODE
INTERNAL CONFIGURATION
(ALAS) JUNCTION CONTACT
OVERALL DIAMETER
(ADAV) 0.210 INCHES NOMINAL
OVERALL LENGTH
(ABHP) 0.146 INCHES NOMINAL
MATERIAL
(MATT) GLASS ENCLOSURE
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT
(CTSG) 125.0 CELSIUS AMBIENT AIR
MOUNTING METHOD
(AXGY) TERMINAL
SEMICONDUCTOR MATERIAL
(CTMZ) SILICON
SPECIAL FEATURES
(FEAT) JUNCTION PATTERN ARRANGEMENT: PIN
TERMINAL LENGTH
(ABJT) 1.070 INCHES NOMINAL
TERMINAL TYPE AND QUANTITY
(TTQY) 2 UNINSULATED WIRE LEAD
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT
(CTSG) 125.0 DEG CELSIUS AMBIENT AIR
UNABLE TO DECODE
(ABBH) UNABLE TO DECODE AND UNABLE TO DECODE
MATERIAL
(MATT) GLASS INCLOSURE
INCLOSURE MATERIAL
(ABBH) METAL AND GLASS

Manufacturer Part Numbers

3CDP

RNCC
3
RNVC
2
91463696

RNCC
5
RNVC
2
91463696

RNCC
5
RNVC
2
PIN3CDP

RNCC
5
RNVC
9
PIN3DP

RNCC
5
RNVC
9

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