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NSN 5961-01-072-6190, 5961010726190
SEMICONDUCTOR DEVICE ASSEMBLY

Federal Supply Classification
FSC 5961 - Semiconductor Devices and Associated Hardware
National Item Identification Number
NIIN 010726190
Codification Country
United States
Item Name Code
INC 35565
Criticality
(X) This item does not have a nuclear hardened feature or any other critical feature such as tolerance, fit restriction or application.
Hazardous Material Indicator Code
(N) There is no data in the HMIRS and the NSN is in an FSC not generally suspected of containing hazardous materials.
Availability: Readily Available Qualified Suppliers: Currently qualifying suppliers

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DLMS® Summary

National Stock Number 5961-01-072-6190

National Stock Number (NSN) 5961-01-072-6190, or NIIN 010726190, (semiconductor device assembly) was assigned March 3, 1979 in the Federal Logistics Information System (FLIS). This NIIN is Available for Manual Assignment. This NSN does not replace any other NSNs.

There is only one manufacturer part number associated with this NSN. One of those part number(s) are considered obsolete. The manufacturer part numbers were originally supplied by 2 suppliers. Today, one supplier is listed as an Active supplier for this NSN. Of the active suppliers, only one supplier is deemed design controlled or valid supply parts.

This part number has not been procured by the US Government in over 5 years.

Based on a planned procurement review by the Primary Inventory Control Activity (PICA) on Aug 26, 2003, this NSN's acquisition method was noted as: Suitable for Competitive Acquisition. (Potential sources shall include dealers/distributors.) The Government physically does not have in its possession sufficient, accurate, or legible data to purchase this part from other than current source(s). (NOTE: This code is applicable only to parts under immediate buy requirements and only as long as the deficiency is under review for resolution and appropriate recoding.) Valid AMCs: 1, 2, 3, 4 and 5.

This NSN is assigned to Item Name Code (INC) 35565. [A GROUPING OF TWO OR MORE SEMICONDUCTING DEVICES SUCH AS LIGHT EMITTING DIODE; SEMICONDUCTOR DEVICE, DIODE; SEMICONDUCTOR DEVICE, PHOTO; SEMICONDUCTOR DEVICE, THYRISTOR; AND/OR TRANSISTOR MOUNTED ON A COMMON MOUNTING OR MOUNTED ON EACH OTHER. THE DEVICES MUST BE SEPARABLE AND EACH ITEM MUST BE CAPABLE OF FUNCTIONING IN ACCORDANCE WITH ITS GIVEN NAME. FOR ASSEMBLIES CONSISTING OF SEMICONDUCTING DEVICES PERMANENTLY CASED, ENCAPSULATED, OR POTTED TOGETHER TO FORM A SINGLE UNIT, SEE RECTIFIER, SEMICONDUCTOR DEVICE, UNITIZED AND SEMICONDUCTOR DEVICES, UNITIZED. EXCLUDES:SEMICONDUCTOR DEVICE SET; MICROCIRCUIT ASSEMBLY; AND MICROCIRCUIT SET. SEE ALSO ABSORBER, OVERVOLTAGE.]. This item does not have a nuclear hardened feature or any other critical feature such as tolerance, fit restriction or application. There is no data in the HMIRS and the NSN is in an FSC not generally suspected of containing hazardous materials. NSN 5961010726190 contains an unknown precious metal.

This NSN is associated to Schedule B 8541500080: semiconductor devices, nesoi. The Schedule B End Use is listed as semiconductors. NAICS classification category 334413: semiconductor and related device manufacturing.

This information was last updated on .


Technical Characteristics

MAJOR COMPONENTS
(AEAS) DIODE 6,PRINTED WIRING BOARD 1
OVERALL HEIGHT
(ABKW) 0.125 INCHES NOMINAL
OVERALL LENGTH
(ABHP) 1.000 INCHES NOMINAL
OVERALL WIDTH
(ABMK) 1.000 INCHES NOMINAL
MOUNTING CONFIGURATION
(ALGC) PLUG IN MTD

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