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NSN 5961-01-080-2677, 5961010802677
SEMICONDUCTOR DEVICE,PHOTO

Federal Supply Classification
FSC 5961 - Semiconductor Devices and Associated Hardware
National Item Identification Number
NIIN 010802677
Codification Country
United States
Item Name Code
INC 20587
Criticality
(X) This item does not have a nuclear hardened feature or any other critical feature such as tolerance, fit restriction or application.
Hazardous Material Indicator Code
(N) There is no data in the HMIRS and the NSN is in an FSC not generally suspected of containing hazardous materials.
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DLMS® Summary

National Stock Number 5961-01-080-2677

National Stock Number (NSN) 5961-01-080-2677, or NIIN 010802677, (semiconductor device,photo) was assigned July 22, 1979 in the Federal Logistics Information System (FLIS). This NIIN is Available for Manual Assignment. This NSN does not replace any other NSNs.

There are 3 manufacturer part numbers associated with this NSN. 2 of those part number(s) are considered obsolete. The manufacturer part numbers were originally supplied by 4 suppliers. Today, 3 suppliers are listed as Active suppliers for this NSN. Of the active suppliers, 2 suppliers are deemed design controlled or valid supply parts.

This part number has not been procured by the US Government in over 5 years.

Based on a planned procurement review by the Primary Inventory Control Activity (PICA) on Aug 02, 2006, this NSN's acquisition method was noted as: Suitable for Competitive Acquisition. (Potential sources shall include dealers/distributors.) This part requires engineering source approval by the design control activity in order to maintain the quality of the part. An alternate source must qualify in accordance with the design control activity's procedures, as approved by the cognizant Government engineering activity. Valid AMCs: 1, 2, 3, 4 and 5.

This NSN is assigned to Item Name Code (INC) 20587. [A SEMICONDUCTOR DEVICE (1) WHICH IS RESPONSIVE TO VISIBLE OR INFRARED RADIANT ENERGY. MAY OR MAY NOT INCLUDE MOUNTING HARDWARE AND/OR HEAT SINK. EXCLUDES:SEMICONDUCTOR DEVICE (1), DIODE; SEMICONDUCTOR DEVICE (1), THYRISTOR AND TRANSISTOR. FOR SOLID STATE DEVICES WHICH EMIT VISIBLE OR INFRARED RADIANT ENERGY, SEE LIGHT EMITTING DIODE.]. This item does not have a nuclear hardened feature or any other critical feature such as tolerance, fit restriction or application. There is no data in the HMIRS and the NSN is in an FSC not generally suspected of containing hazardous materials. NSN 5961010802677 does not contain precious metals.

This NSN is associated to Schedule B 8541409500: photosensitive semiconductor devices, nesoi. The Schedule B End Use is listed as semiconductors. NAICS classification category 334413: semiconductor and related device manufacturing.

This information was last updated on .


Technical Characteristics

INCLOSURE MATERIAL
(ABBH) METAL AND GLASS
UNABLE TO DECODE
(ABBH) UNABLE TO DECODE AND UNABLE TO DECODE
CURRENT RATING PER CHARACTERISTIC
(CTQX) 100.00 NANOAMPERES EMITTER CURRENT, DC PEAK
CURRENT RATING PER CHARACTERISTIC
(CTQX) 100.00 NANOAMPERES NOMINAL DARK CURRENT
FEATURES PROVIDED
(CBBL) HERMETICALLY SEALED CASE
OVERALL DIAMETER
(ADAV) 0.550 INCHES MINIMUM AND 0.650 INCHES MAXIMUM
OVERALL LENGTH
(ABHP) 0.270 INCHES MINIMUM AND 0.330 INCHES MAXIMUM
MATERIAL
(MATT) GLASS INCLOSURE
MOUNTING METHOD
(AXGY) TERMINAL
SPECIAL FEATURES
(FEAT) 275V TO 425V OPERATING RANGE
SEMICONDUCTOR MATERIAL
(CTMZ) SILICON
TERMINAL TYPE AND QUANTITY
(TTQY) 3 UNINSULATED WIRE LEAD

Manufacturer Part Numbers

11507657

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