National Stock Number
5961-01-155-2259
National Stock Number (NSN) 5961-01-155-2259, or NIIN 011552259, (semiconductor device assembly) was assigned June 6, 1983 in the Federal Logistics Information System (FLIS). This NIIN is Available for Manual Assignment. This NSN does not replace any other NSNs.
There are no manufacturer part numbers associated to this NSN.
This part number has not been procured by the US Government in over 5 years.
Based on a planned procurement review by the Primary Inventory Control Activity (PICA) on Apr 02, 1991, this NSN's acquisition method was noted as: Suitable for Competitive Acquisition. (Potential sources shall include dealers/distributors.) The Government has unlimited rights to the technical data, and the data package is complete. Valid AMCs: 1 and 2.
This NSN is assigned to Item Name Code (INC) 35565. [A GROUPING OF TWO OR MORE SEMICONDUCTING DEVICES SUCH AS LIGHT EMITTING DIODE; SEMICONDUCTOR DEVICE, DIODE; SEMICONDUCTOR DEVICE, PHOTO; SEMICONDUCTOR DEVICE, THYRISTOR; AND/OR TRANSISTOR MOUNTED ON A COMMON MOUNTING OR MOUNTED ON EACH OTHER. THE DEVICES MUST BE SEPARABLE AND EACH ITEM MUST BE CAPABLE OF FUNCTIONING IN ACCORDANCE WITH ITS GIVEN NAME. FOR ASSEMBLIES CONSISTING OF SEMICONDUCTING DEVICES PERMANENTLY CASED, ENCAPSULATED, OR POTTED TOGETHER TO FORM A SINGLE UNIT, SEE RECTIFIER, SEMICONDUCTOR DEVICE, UNITIZED AND SEMICONDUCTOR DEVICES, UNITIZED. EXCLUDES:SEMICONDUCTOR DEVICE SET; MICROCIRCUIT ASSEMBLY; AND MICROCIRCUIT SET. SEE ALSO ABSORBER, OVERVOLTAGE.]. This item does not have a nuclear hardened feature or any other critical feature such as tolerance, fit restriction or application. There is no data in the HMIRS and the NSN is in an FSC not generally suspected of containing hazardous materials. NSN 5961011552259 does not contain precious metals.
This NSN is associated to Schedule B 8541500080: semiconductor devices, nesoi. The Schedule B End Use is listed as semiconductors. NAICS classification category 334413: semiconductor and related device manufacturing.
This information was last updated on Apr 01, 2024.