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NSN 5961-01-162-2189, 5961011622189
SEMICONDUCTOR DEVICE ASSEMBLY

Federal Supply Classification
FSC 5961 - Semiconductor Devices and Associated Hardware
National Item Identification Number
NIIN 011622189
Codification Country
United States
Item Name Code
INC 35565
Criticality
(X) This item does not have a nuclear hardened feature or any other critical feature such as tolerance, fit restriction or application.
Hazardous Material Indicator Code
(N) There is no data in the HMIRS and the NSN is in an FSC not generally suspected of containing hazardous materials.
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DLMS® Summary

National Stock Number 5961-01-162-2189

National Stock Number (NSN) 5961-01-162-2189, or NIIN 011622189, (semiconductor device assembly) was assigned September 15, 1983 in the Federal Logistics Information System (FLIS). This NIIN is Available for Manual Assignment. This NSN does not replace any other NSNs.

There is only one manufacturer part number associated with this NSN. None of the associated part number(s) are considered obsolete. The manufacturer part numbers were originally supplied by one supplier. Today, one supplier is listed as an Active supplier for this NSN. Of the active suppliers, only one supplier is deemed design controlled or valid supply parts. ISO Group has several sources of supply for this NSN.

This part number has not been procured by the US Government in over 5 years, with the most recent procurement date of Apr 23, 2012. There have been 3 contracts issued for this part number, with 3 awards given. There is minimal competition for this NSN. The US Government has awarded contracts to 2 different suppliers. The last contract numbers awarded were: SPRPA112D007W, W58RGZ06G0003, SPM4A711ML357. The total value of the awarded contracts has been US$ 2,391.60.

This NSN is somewhat common among different platforms, belonging to 4 different weapons systems.

There has been very little demand for this national stock number. The demand for this NSN originated from less than 5 countries. Based on a planned procurement review by the Primary Inventory Control Activity (PICA) on Mar 10, 2010, this NSN's acquisition method was noted as: Acquire directly from the actual manufacturer, whether or not the prime contractor is the actual manufacturer. This part requires engineering source approval by the design control activity in order to maintain the quality of the part. An alternate source must qualify in accordance with the design control activity's procedures, as approved by the cognizant Government engineering activity. Valid AMCs: 1, 2, 3, 4 and 5.

This NSN is assigned to Item Name Code (INC) 35565. [A GROUPING OF TWO OR MORE SEMICONDUCTING DEVICES SUCH AS LIGHT EMITTING DIODE; SEMICONDUCTOR DEVICE, DIODE; SEMICONDUCTOR DEVICE, PHOTO; SEMICONDUCTOR DEVICE, THYRISTOR; AND/OR TRANSISTOR MOUNTED ON A COMMON MOUNTING OR MOUNTED ON EACH OTHER. THE DEVICES MUST BE SEPARABLE AND EACH ITEM MUST BE CAPABLE OF FUNCTIONING IN ACCORDANCE WITH ITS GIVEN NAME. FOR ASSEMBLIES CONSISTING OF SEMICONDUCTING DEVICES PERMANENTLY CASED, ENCAPSULATED, OR POTTED TOGETHER TO FORM A SINGLE UNIT, SEE RECTIFIER, SEMICONDUCTOR DEVICE, UNITIZED AND SEMICONDUCTOR DEVICES, UNITIZED. EXCLUDES:SEMICONDUCTOR DEVICE SET; MICROCIRCUIT ASSEMBLY; AND MICROCIRCUIT SET. SEE ALSO ABSORBER, OVERVOLTAGE.]. This item does not have a nuclear hardened feature or any other critical feature such as tolerance, fit restriction or application. There is no data in the HMIRS and the NSN is in an FSC not generally suspected of containing hazardous materials. NSN 5961011622189 does not contain precious metals.

This NSN is associated to Schedule B 8541500080: semiconductor devices, nesoi. The Schedule B End Use is listed as semiconductors. NAICS classification category 334413: semiconductor and related device manufacturing.

This information was last updated on .


Technical Characteristics

MAJOR COMPONENTS
(AEAS) DIODE 2; HEAT SHRINK TUBE 1

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