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NSN 5961-01-298-5011, 5961012985011
SEMICONDUCTOR DEVICES,UNITIZED

Federal Supply Classification
FSC 5961 - Semiconductor Devices and Associated Hardware
National Item Identification Number
NIIN 012985011
Codification Country
United States
Item Name Code
INC 61962
Criticality
(X) This item does not have a nuclear hardened feature or any other critical feature such as tolerance, fit restriction or application.
Hazardous Material Indicator Code
(N) There is no data in the HMIRS and the NSN is in an FSC not generally suspected of containing hazardous materials.
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DLMS® Summary

National Stock Number 5961-01-298-5011

National Stock Number (NSN) 5961-01-298-5011, or NIIN 012985011, (semiconductor devices,unitized) was assigned April 17, 1989 in the Federal Logistics Information System (FLIS). This NIIN is Available for Manual Assignment. This NSN does not replace any other NSNs.

There are 4 manufacturer part numbers associated with this NSN. 3 of those part number(s) are considered obsolete. The manufacturer part numbers were originally supplied by 4 suppliers. Today, 2 suppliers are listed as Active suppliers for this NSN. Of the active suppliers, 2 suppliers are deemed design controlled or valid supply parts. ISO Group has several sources of supply for this NSN.

This part number has been procured by the US Government within the last year, but shows no recent (last 90 days) procurement activity. There have been 6 contracts issued for this part number, with 6 awards given. There is minimal competition for this NSN. The US Government has awarded contracts to 3 different suppliers. The last contract numbers awarded were: SPE7M525P0227, SPE7M522P1591, SPE7M522P1591, SPM7M614M0020, SPM7M613M1134. The total value of the awarded contracts has been US$ 487,410.50.

This NSN is very common among different weapons systems, belonging to 33 different platforms.

There has been a small amount of demand for this national stock number. The demand for this NSN originated from less than 5 countries. The 24 month forecast from the US Government for this part number has medium volatility, with an estimated forecasted value of US$ 205,761. Based on a planned procurement review by the Primary Inventory Control Activity (PICA) on Aug 01, 2020, this NSN's acquisition method was noted as: Suitable for Competitive Acquisition. (Potential sources shall include dealers/distributors.) Acquisition of this part is restricted to source(s) specified on "Source Control", "Altered Item" or "Selected Item" drawings/documents. Valid AMCs: 1, 2, 3, 4 and 5.

This NSN is assigned to Item Name Code (INC) 61962. [TWO OR MORE DISCRETE SEMICONDUCTOR DEVICES SUCH AS DIODE(S) AND/OR TRANSISTOR(S), PERMANENTLY CASED, ENCAPSULATED, OR POTTED TOGETHER TO FORM AN INSEPARABLE UNIT. EXCLUDES:DEVICES HAVING ONE OR MORE COMPONENTS OTHER THAN SEMICONDUCTOR DEVICES. THE INDIVIDUALLY DISTINCT DEVICES FORMING THE UNIT MAY BE INTERNALLY CONNECTED. THE UNIT IN ITSELF DOES NOT PERFORM A COMPLETE SPECIFIC FUNCTION AND CANNOT BE ASSIGNED A MORE DEFINITE ITEM NAME. IT MAY INCLUDE OR CONSIST OF INSEPARABLE MATCHED PAIRS. MAY OR MAY NOT INCLUDE MOUNTING HARDWARE AND/OR HEATSINK. FOR INTERCONNECTED ITEMS ARRANGED IN STACK(S), SEE RECTIFIER, SEMICONDUCTOR DEVICE. FOR ITEMS FORMED ON OR WITHIN A SEMICONDUCTOR MATERIAL SUBSTRATE, FORMED ON AN INSULATING SUBSTRATE OR FORMED ON A COMBINATION OF BOTH OF THESE TYPES, SEE MICROCIRCUIT (AS MODIFIED). EXCLUDES:NETWORK (AS MODIFIED); ABSORBER, OVERVOLTAGE; SEMICONDUCTOR DEVICE SET; AND SEMICONDUCTOR DEVICE ASSEMBLY. DO NOT USE IF MORE SPECIFIC NAME APPLIES.]. This item does not have a nuclear hardened feature or any other critical feature such as tolerance, fit restriction or application. There is no data in the HMIRS and the NSN is in an FSC not generally suspected of containing hazardous materials. NSN 5961012985011 contains gold.

This NSN is associated to Schedule B 8541500080: semiconductor devices, nesoi. The Schedule B End Use is listed as semiconductors. NAICS classification category 334413: semiconductor and related device manufacturing.

This information was last updated on .


Technical Characteristics

COMPONENT NAME AND QUANTITY
(ASKA) 3 SEMICONDUCTOR DEVICE DIODE
OVERALL HEIGHT
(ABKW) 0.290 INCHES MAXIMUM
OVERALL LENGTH
(ABHP) 0.970 INCHES MINIMUM AND 0.980 INCHES MAXIMUM
OVERALL WIDTH
(ABMK) 0.505 INCHES MAXIMUM
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT
(CTSG) 125.0 CELSIUS AMBIENT AIR
MOUNTING FACILITY QUANTITY
(AKPV) 2
MOUNTING METHOD
(AXGY) UNTHREADED HOLE
PRECIOUS MATERIAL AND LOCATION
(PMLC) PLATED LEADS GOLD
PRECIOUS MATERIAL
(PRMT) GOLD
RESPONSE TIME
(ASCK) 700.0 NANOSECONDS MINIMUM ALL SEMICONDUCTOR DEVICE DIODE
SPECIAL FEATURES
(FEAT) COMMON ANODE PIN DIODE SWITCH
TERMINAL LENGTH
(ABJT) 0.350 INCHES MINIMUM
TERMINAL TYPE AND QUANTITY
(TTQY) 4 RIBBON
TEST DATA DOCUMENT
(TEST) 80063-A3012735 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING)
VOLTAGE RATING IN VOLTS PER CHARACTERISTIC
(CTQN) 400.0 MINIMUM BREAKDOWN VOLTAGE, DC AND 1.2 MAXIMUM FORWARD VOLTAGE, DC ALL SEMICONDUCTOR DEVICE DIODE
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT
(CTSG) 125.0 DEG CELSIUS AMBIENT AIR

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