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NSN 5961-01-311-3275, 5961013113275
SEMICONDUCTOR DEVICE ASSEMBLY

Federal Supply Classification
FSC 5961 - Semiconductor Devices and Associated Hardware
National Item Identification Number
NIIN 013113275
Codification Country
United States
Item Name Code
INC 35565
Criticality
(X) This item does not have a nuclear hardened feature or any other critical feature such as tolerance, fit restriction or application.
Hazardous Material Indicator Code
(N) There is no data in the HMIRS and the NSN is in an FSC not generally suspected of containing hazardous materials.
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DLMS® Summary

National Stock Number 5961-01-311-3275

National Stock Number (NSN) 5961-01-311-3275, or NIIN 013113275, (semiconductor device assembly) was assigned November 23, 1989 in the Federal Logistics Information System (FLIS). This NIIN is Available for Manual Assignment. This NSN does not replace any other NSNs.

There are 2 manufacturer part numbers associated with this NSN. One of those part number(s) are considered obsolete. The manufacturer part numbers were originally supplied by 4 suppliers. Today, 3 suppliers are listed as Active suppliers for this NSN. Of the active suppliers, 2 suppliers are deemed design controlled or valid supply parts. ISO Group has several sources of supply for this NSN.

This part number has not been procured by the US Government in over 5 years.

This NSN is somewhat common among different platforms, belonging to 4 different weapons systems.

Based on a planned procurement review by the Primary Inventory Control Activity (PICA) on Dec 10, 2014, this NSN's acquisition method was noted as: Acquire only from the prime contractor although the engineering data identifies the Commercial and Government Entity Code (CAGE) and part number of a source other than the prime contractor. The data needed to produce this item from additional sources is not physically available. Valid AMCs: 3, 4 and 5.

This NSN is assigned to Item Name Code (INC) 35565. [A GROUPING OF TWO OR MORE SEMICONDUCTING DEVICES SUCH AS LIGHT EMITTING DIODE; SEMICONDUCTOR DEVICE, DIODE; SEMICONDUCTOR DEVICE, PHOTO; SEMICONDUCTOR DEVICE, THYRISTOR; AND/OR TRANSISTOR MOUNTED ON A COMMON MOUNTING OR MOUNTED ON EACH OTHER. THE DEVICES MUST BE SEPARABLE AND EACH ITEM MUST BE CAPABLE OF FUNCTIONING IN ACCORDANCE WITH ITS GIVEN NAME. FOR ASSEMBLIES CONSISTING OF SEMICONDUCTING DEVICES PERMANENTLY CASED, ENCAPSULATED, OR POTTED TOGETHER TO FORM A SINGLE UNIT, SEE RECTIFIER, SEMICONDUCTOR DEVICE, UNITIZED AND SEMICONDUCTOR DEVICES, UNITIZED. EXCLUDES:SEMICONDUCTOR DEVICE SET; MICROCIRCUIT ASSEMBLY; AND MICROCIRCUIT SET. SEE ALSO ABSORBER, OVERVOLTAGE.]. This item does not have a nuclear hardened feature or any other critical feature such as tolerance, fit restriction or application. There is no data in the HMIRS and the NSN is in an FSC not generally suspected of containing hazardous materials. NSN 5961013113275 does not contain precious metals.

This NSN is associated to Schedule B 8541500080: semiconductor devices, nesoi. The Schedule B End Use is listed as semiconductors. NAICS classification category 334413: semiconductor and related device manufacturing.

This information was last updated on .


Technical Characteristics

MAJOR COMPONENTS
(AEAS) NEGATIVE DIODE 3; HEAT SINK 1

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1209

RNCC
C
RNVC
1
101209

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3
RNVC
2
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RNCC
5
RNVC
2
101209

RNCC
5
RNVC
9

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