National Stock Number
5961-01-546-7556
National Stock Number (NSN) 5961-01-546-7556, or NIIN 015467556, (rectifier,semiconductor device) was assigned December 28, 2006 in the Federal Logistics Information System (FLIS). This NIIN is Available for Manual Assignment. This NSN does not replace any other NSNs.
There is only one manufacturer part number associated with this NSN. None of the associated part number(s) are considered obsolete. The manufacturer part numbers were originally supplied by one supplier. Today, one supplier is listed as an Active supplier for this NSN. Of the active suppliers, only one supplier is deemed design controlled or valid supply parts. ISO Group has several sources of supply for this NSN.
This part number has not been procured by the US Government in over 5 years.
This NSN is somewhat common among different platforms, belonging to 2 different weapons systems.
Based on a planned procurement review by the Primary Inventory Control Activity (PICA) on Dec 29, 2006, this NSN's acquisition method was noted as: Suitable for Competitive Acquisition. (Potential sources shall include dealers/distributors.) This part is a commercial/non-developmental/off-the-shelf-item. Valid AMCs: 1, 2, 3, 4 and 5.
This NSN is assigned to Item Name Code (INC) 00300. [TWO OR MORE INTERCONNECTED SEMICONDUCTOR DEVICE (1), DIODE ARRANGED IN STACK(S) FOR USE IN POWER SUPPLIES TO CHANGE ALTERNATING CURRENT TO DIRECT CURRENT. FOR ITEMS CONTAINING MATERIAL SUCH AS SELENIUM OR COPPER OXIDE, SEE RECTIFIER, METALLIC.]. This item does not have a nuclear hardened feature or any other critical feature such as tolerance, fit restriction or application. There is no data in the HMIRS and the NSN is in an FSC not generally suspected of containing hazardous materials. NSN 5961015467556 does not contain precious metals.
This NSN is associated to Schedule B 8541900000: diode, transistor & similar semiconductor device parts. The Schedule B End Use is listed as semiconductors. NAICS classification category 334413: semiconductor and related device manufacturing.
This information was last updated on Jul 01, 2025.