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NSN 5961-01-626-6110, 5961016266110
SEMICONDUCTOR DEVICES,UNITIZED

Federal Supply Classification
FSC 5961 - Semiconductor Devices and Associated Hardware
National Item Identification Number
NIIN 016266110
Codification Country
United States
Item Name Code
INC 61962
Criticality
(X) This item does not have a nuclear hardened feature or any other critical feature such as tolerance, fit restriction or application.
Hazardous Material Indicator Code
(N) There is no data in the HMIRS and the NSN is in an FSC not generally suspected of containing hazardous materials.
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DLMS® Summary

National Stock Number 5961-01-626-6110

National Stock Number (NSN) 5961-01-626-6110, or NIIN 016266110, (semiconductor devices,unitized) was assigned March 17, 2014 in the Federal Logistics Information System (FLIS). This NIIN is Available for Manual Assignment. This NSN does not replace any other NSNs.

There are 2 manufacturer part numbers associated with this NSN. None of the associated part number(s) are considered obsolete. The manufacturer part numbers were originally supplied by 2 suppliers. Today, 2 suppliers are listed as Active suppliers for this NSN. Of the active suppliers, 2 suppliers are deemed design controlled or valid supply parts.

This part number has not been procured by the US Government in over 5 years.

This NSN is unique to one weapons system.

Based on a planned procurement review by the Primary Inventory Control Activity (PICA) on Mar 18, 2014, this NSN's acquisition method was noted as: Acquire directly from the actual manufacturer, whether or not the prime contractor is the actual manufacturer. The Government physically does not have in its possession sufficient, accurate, or legible data to purchase this part from other than current source(s). (NOTE: This code is applicable only to parts under immediate buy requirements and only as long as the deficiency is under review for resolution and appropriate recoding.) Valid AMCs: 1, 2, 3, 4 and 5.

This NSN is assigned to Item Name Code (INC) 61962. [TWO OR MORE DISCRETE SEMICONDUCTOR DEVICES SUCH AS DIODE(S) AND/OR TRANSISTOR(S), PERMANENTLY CASED, ENCAPSULATED, OR POTTED TOGETHER TO FORM AN INSEPARABLE UNIT. EXCLUDES:DEVICES HAVING ONE OR MORE COMPONENTS OTHER THAN SEMICONDUCTOR DEVICES. THE INDIVIDUALLY DISTINCT DEVICES FORMING THE UNIT MAY BE INTERNALLY CONNECTED. THE UNIT IN ITSELF DOES NOT PERFORM A COMPLETE SPECIFIC FUNCTION AND CANNOT BE ASSIGNED A MORE DEFINITE ITEM NAME. IT MAY INCLUDE OR CONSIST OF INSEPARABLE MATCHED PAIRS. MAY OR MAY NOT INCLUDE MOUNTING HARDWARE AND/OR HEATSINK. FOR INTERCONNECTED ITEMS ARRANGED IN STACK(S), SEE RECTIFIER, SEMICONDUCTOR DEVICE. FOR ITEMS FORMED ON OR WITHIN A SEMICONDUCTOR MATERIAL SUBSTRATE, FORMED ON AN INSULATING SUBSTRATE OR FORMED ON A COMBINATION OF BOTH OF THESE TYPES, SEE MICROCIRCUIT (AS MODIFIED). EXCLUDES:NETWORK (AS MODIFIED); ABSORBER, OVERVOLTAGE; SEMICONDUCTOR DEVICE SET; AND SEMICONDUCTOR DEVICE ASSEMBLY. DO NOT USE IF MORE SPECIFIC NAME APPLIES.]. This item does not have a nuclear hardened feature or any other critical feature such as tolerance, fit restriction or application. There is no data in the HMIRS and the NSN is in an FSC not generally suspected of containing hazardous materials. NSN 5961016266110 does not contain precious metals.

This NSN is associated to Schedule B 8541500080: semiconductor devices, nesoi. The Schedule B End Use is listed as semiconductors. NAICS classification category 334413: semiconductor and related device manufacturing.

This information was last updated on .


Technical Characteristics

COMPONENT NAME AND QUANTITY
(ASKA) 1 SEMICONDUCTOR DEVICE DIODE
CURRENT RATING PER CHARACTERISTIC
(CTQX) 38.8 AMPERES MAXIMUM FORWARD CURRENT, MAXIMUM PEAK TOTAL VALUE 1ST SEMICONDUCTOR DEVICE DIODE
FUNCTION FOR WHICH DESIGNED
(AFZC) BIDIRECTIONAL AND TRANSIENT SUPPRESSOR
INCLOSURE MATERIAL
(ABBH) PLASTIC
OVERALL HEIGHT
(ABKW) 0.090 INCHES MINIMUM AND 0.115 INCHES MAXIMUM
OVERALL LENGTH
(ABHP) 0.190 INCHES MINIMUM AND 0.220 INCHES MAXIMUM
OVERALL WIDTH
(ABMK) 0.080 INCHES MINIMUM AND 0.103 INCHES MAXIMUM
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT
(CTSG) 75.0 DEG CELSIUS AMBIENT AIR
MOUNTING METHOD
(AXGY) TERMINAL
RESPONSE TIME
(ASCK) 4.0 NANOSECONDS MAXIMUM 1ST SEMICONDUCTOR DEVICE DIODE
SEMICONDUCTOR MATERIAL
(CTMZ) SILICON 1ST SEMICONDUCTOR DEVICE DIODE
PART NAME ASSIGNED BY CONTROLLING AGENCY
(CXCY) SMAJ TRANSIENT VOLTAGE SUPPRESSOR DIODE, BIDIRECTIONAL
POWER RATING PER CHARACTERISTIC
(CTRD) 400.0 WATTS MAXIMUM PEAK TURN-OFF POWER DISSIPATION 1ST SEMICONDUCTOR DEVICE DIODE
SPECIAL FEATURES
(FEAT) ROHS COMPLIANT, LEAD FREE, UL CLASS 94 V0
VOLTAGE RATING IN VOLTS PER CHARACTERISTIC
(CTQN) 6.0 MAXIMUM WORKING PEAK REVERSE VOLTAGE 1ST SEMICONDUCTOR DEVICE DIODE
TERMINAL LENGTH
(ABJT) 0.030 INCHES MINIMUM AND 0.060 INCHES MAXIMUM
TERMINAL TYPE AND QUANTITY
(TTQY) 2 TAB, SOLDER LUG

Manufacturer Part Numbers


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