National Stock Number
5962-00-406-3670
National Stock Number (NSN) 5962-00-406-3670, or NIIN 004063670, (microcircuit,linear) was assigned January 15, 1972 in the Federal Logistics Information System (FLIS). This NIIN is Available for Manual Assignment. This NSN does not replace any other NSNs.
There are 2 manufacturer part numbers associated with this NSN. None of the associated part number(s) are considered obsolete. The manufacturer part numbers were originally supplied by 2 suppliers. Today, 2 suppliers are listed as Active suppliers for this NSN. Of the active suppliers, only one supplier is deemed design controlled or valid supply parts.
This part number has not been procured by the US Government in over 5 years.
This NSN is unique to one weapons system.
Based on a planned procurement review by the Primary Inventory Control Activity (PICA) on Aug 02, 2006, this NSN's acquisition method was noted as: Acquire directly from the actual manufacturer, whether or not the prime contractor is the actual manufacturer. The annual buy value of this part falls below the screening threshold of $10,000 but it has been screened for known source(s). (NOTE: This code shall not be used when screening parts entering the inventory. It shall not be assigned in preference to or supersede any other AMSC.) Valid AMCs: 1, 2, 3, 4 and 5.
This NSN is assigned to Item Name Code (INC) 31778. [A MICROCIRCUIT WHOSE OUTPUT IS A FUNCTION OF THE INPUT; THAT IS, THE OUTPUT VARIES IN A PREDETERMINED AND ESSENTIALLY PREDICTABLE MANNER FROM THE INPUT SIGNAL.]. This item does not have a nuclear hardened feature or any other critical feature such as tolerance, fit restriction or application. There is no data in the HMIRS and the NSN is in an FSC not generally suspected of containing hazardous materials. NSN 5962004063670 contains gold.
This NSN is associated to Schedule B 8542900000: electronic integrated circuits and microassembly parts. The Schedule B End Use is listed as semiconductors. NAICS classification category 334413: semiconductor and related device manufacturing.
This information was last updated on Sep 01, 2024.