National Stock Number
5962-01-249-4951
National Stock Number (NSN) 5962-01-249-4951, or NIIN 012494951, (microcircuit,linear) was assigned February 11, 1987 in the Federal Logistics Information System (FLIS). This NIIN is Available for Manual Assignment. This NSN does not replace any other NSNs.
There are 4 manufacturer part numbers associated with this NSN. None of the associated part number(s) are considered obsolete. The manufacturer part numbers were originally supplied by 3 suppliers. Today, 3 suppliers are listed as Active suppliers for this NSN. Of the active suppliers, there are no suppliers that are deemed design controlled or valid supply parts.
This part number has not been procured by the US Government in over 5 years.
Based on a planned procurement review by the Primary Inventory Control Activity (PICA) on Aug 02, 2006, this NSN's acquisition method was noted as: Acquire directly from the actual manufacturer, whether or not the prime contractor is the actual manufacturer. This part requires engineering source approval by the design control activity in order to maintain the quality of the part. An alternate source must qualify in accordance with the design control activity's procedures, as approved by the cognizant Government engineering activity. Valid AMCs: 1, 2, 3, 4 and 5.
This NSN is assigned to Item Name Code (INC) 31778. [A MICROCIRCUIT WHOSE OUTPUT IS A FUNCTION OF THE INPUT; THAT IS, THE OUTPUT VARIES IN A PREDETERMINED AND ESSENTIALLY PREDICTABLE MANNER FROM THE INPUT SIGNAL.]. This item does not have a nuclear hardened feature but does have other critical feature(s) such as tolerance, fit restriction or application. There is no data in the HMIRS and the NSN is in an FSC not generally suspected of containing hazardous materials. NSN 5962012494951 does not contain precious metals.
This NSN is associated to Schedule B 8542900000: electronic integrated circuits and microassembly parts. The Schedule B End Use is listed as semiconductors. NAICS classification category 334413: semiconductor and related device manufacturing.
This information was last updated on May 01, 2024.