National Stock Number
5962-01-414-5875
National Stock Number (NSN) 5962-01-414-5875, or NIIN 014145875, (microcircuit,hybrid) was assigned June 9, 1995 in the Federal Logistics Information System (FLIS). This NIIN is Available for Manual Assignment. This NSN does not replace any other NSNs.
There are 2 manufacturer part numbers associated with this NSN. One of those part number(s) are considered obsolete. The manufacturer part numbers were originally supplied by 2 suppliers. Today, 2 suppliers are listed as Active suppliers for this NSN. Of the active suppliers, 2 suppliers are deemed design controlled or valid supply parts.
This part number has not been procured by the US Government in over 5 years.
Based on a planned procurement review by the Primary Inventory Control Activity (PICA) on May 23, 2008, this NSN's acquisition method was noted as: Suitable for Competitive Acquisition. (Potential sources shall include dealers/distributors.) The data or the rights to use the data needed to purchase this part from additional sources are not owned by the Government and it has been determined that it is uneconomical to purchase them. Valid AMCs: 1, 2, 3, 4 and 5.
This NSN is assigned to Item Name Code (INC) 41014. [A CIRCUIT IN WHICH ONE TYPE OF MICROCIRCUIT IS COMBINED WITH SOME OTHER TYPE OF MICROCIRCUIT OR WITH DISCRETE COMPONENTS. FOR TWO MICROCIRCUITS ON A COMMON MOUNTING OR ON EACH OTHER, SEE MICROCIRCUIT ASSEMBLY. FOR MICROCIRCUITS HAVING A COMPLETE INDEPENDENT MEMORY FUNCTION, SEE MICROCIRCUIT (1), MEMORY.]. This item does not have a nuclear hardened feature or any other critical feature such as tolerance, fit restriction or application. There is no data in the HMIRS and the NSN is in an FSC not generally suspected of containing hazardous materials. NSN 5962014145875 does not contain precious metals.
This NSN is associated to Schedule B 8542900000: electronic integrated circuits and microassembly parts. The Schedule B End Use is listed as semiconductors. NAICS classification category 334413: semiconductor and related device manufacturing.
This information was last updated on Sep 01, 2024.