National Stock Number
5962-01-454-0470
National Stock Number (NSN) 5962-01-454-0470, or NIIN 014540470, (microcircuit assembly) was assigned March 18, 1998 in the Federal Logistics Information System (FLIS). This NIIN is Available for Manual Assignment. This NSN does not replace any other NSNs.
There are 2 manufacturer part numbers associated with this NSN. None of the associated part number(s) are considered obsolete. The manufacturer part numbers were originally supplied by 2 suppliers. Today, 2 suppliers are listed as Active suppliers for this NSN. Of the active suppliers, only one supplier is deemed design controlled or valid supply parts.
This part number has not been procured by the US Government in over 5 years.
This NSN is assigned to Item Name Code (INC) 33695. [A GROUPING OF TWO OR MORE INDIVIDUAL MICROCIRCUITS MOUNTED ON A COMMON MOUNTING OR ON EACH OTHER. EACH MICROCIRCUIT MUST BE SEPARABLE AND CAPABLE OF FUNCTIONING IN ACCORDANCE WITH ITS GIVEN NAME. THE ITEM IS GENERALLY PART OF AN ELECTRICAL/ELECTRONIC SUBASSEMBLY AND CANNOT BE ASSIGNED A MORE SPECIFIC ITEM NAME. IT EXCLUDES:ITEMS CONTAINING ELECTRICAL/ELECTRONIC COMPONENTS OTHER THAN MICROCIRCUITS, EXCEPT THAT WHEN MOUNTED ON A PRINTED WIRING BOARD IT MAY INCLUDE A CONNECTOR(S). FOR ITEMS CONTAINING OTHER COMPONENTS IN ADDITITION TO MICROCIRCUITS SEE CIRCUIT CARD ASSEMBLY AND ELECTRONIC COMPONENTS ASSEMBLY. F0R ITEMS HAVING A COMPLETE INDIVIDUAL ELECTRICAL/ELECTRONIC FUNCTION, USE THE APPLICABLE ITEM NAME SUCH AS AMPLIFIER (AS MODIFIED), OSCILLATOR (AS MODIFIED) OR POWER SUPPLY.]. This item does not have a nuclear hardened feature or any other critical feature such as tolerance, fit restriction or application. There is no data in the HMIRS and the NSN is in an FSC not generally suspected of containing hazardous materials. NSN 5962014540470 contains gold.
This NSN is associated to Schedule B 8542900000: electronic integrated circuits and microassembly parts. The Schedule B End Use is listed as semiconductors. NAICS classification category 334413: semiconductor and related device manufacturing.
This information was last updated on May 01, 2024.