National Stock Number
5998-00-001-3632
National Stock Number (NSN) 5998-00-001-3632, or NIIN 000013632, (electronic components assembly) was assigned September 27, 1972 in the Federal Logistics Information System (FLIS). This NIIN is Available for Manual Assignment. This NSN does not replace any other NSNs.
There are no manufacturer part numbers associated to this NSN.
This part number has not been procured by the US Government in over 5 years.
Based on a planned procurement review by the Primary Inventory Control Activity (PICA) on Apr 02, 1991, this NSN's acquisition method was noted as: Acquire directly from the actual manufacturer, whether or not the prime contractor is the actual manufacturer. The rights to use the data needed to purchase this part from additional sources are not owned by the Government and cannot be purchased. Valid AMCs: 1, 2, 3, 4 and 5.
This NSN is assigned to Item Name Code (INC) 26088. [A GROUPING OF TWO OR MORE DIFFERENT TYPES OF ELECTRICAL/ELECTRONIC COMPONENTS MOUNTED ON A COMMON MOUNTING. IT MAY INCLUDE AN ASSEMBLY OF ELECTRICAL/ELECTRONIC COMPONENTS MOUNTED ON MULTIPLE PRINTED WIRING BOARD(S) MOUNTED BACK TO BACK, STACKED, AND THE LIKE. THE ITEM IS GENERALLY A COMPONENT OF A SUBASSEMBLY AND CANNOT BE ASSIGNED A MORE DEFINITE ITEM NAME. EXCLUDES ITEMS WHICH MAY BE IDENTIFIED AS A SUBASSEMBLY. FOR AN ASSEMBLY OF ELECTRICAL/ELECTRONIC COMPONENTS MOUNTED ON A SINGLE PRINTED WIRING BOARD, SEE CIRCUIT CARD ASSEEMBLY. DO NOT USE IF A MORE SPECIFIC NAME APPLIES.]. The item is a non-aviation Critical Safety Item (CSI) whose failure will result in serious damage to equipment or serious injury or death to personnel. There is no data in the HMIRS and the NSN is in an FSC not generally suspected of containing hazardous materials. NSN 5998000013632 does not contain precious metals.
This NSN is associated to Schedule B 8542900000: electronic integrated circuits and microassembly parts. The Schedule B End Use is listed as semiconductors. NAICS classification category 334413: semiconductor and related device manufacturing.
This information was last updated on Jul 01, 2025.