National Stock Number
5998-01-032-9052
National Stock Number (NSN) 5998-01-032-9052, or NIIN 010329052, (holder,printed circuit board) was assigned December 24, 1976 in the Federal Logistics Information System (FLIS). This NIIN is Available for Manual Assignment. This NSN does not replace any other NSNs.
There are 5 manufacturer part numbers associated with this NSN. One of those part number(s) are considered obsolete. The manufacturer part numbers were originally supplied by 4 suppliers. Today, 3 suppliers are listed as Active suppliers for this NSN. Of the active suppliers, 2 suppliers are deemed design controlled or valid supply parts.
This part number has not been procured by the US Government in over 5 years.
This NSN is somewhat common among different platforms, belonging to 4 different weapons systems.
Based on a planned procurement review by the Primary Inventory Control Activity (PICA) on Jun 02, 2006, this NSN's acquisition method was noted as: Not established. Not established.
This NSN is assigned to Item Name Code (INC) 31600. [A HOLDER DESIGNED TO ACCOMMODATE AND POSITION ONE OR MORE PRINTED CIRCUIT BOARDS OR ONE OR MORE CIRCUIT CARD ASSEMBLIES. IT IS USUALLY AN OPEN FRAME STRUCTURE WITH PRINTED CIRCUIT BOARD GUIDES MOUNTED BETWEEN PARALLEL SUPPORT BARS AND END SUPPORTS. IT IS DESIGNED TO BE MOUNTED IN ELECTRICAL CABINETS, CASES, DRAWERS AND RACKS TO PROVIDE MOUNTING FACILITIES FOR PRINTED CIRCUIT BOARDS. SEE ALSO CABINET,ELECTRICAL EQUIPMENT; CASE (AS MODIFIED); DRAWER,ELECTRICAL EQUIPMENT; AND RACK,ELECTRICAL EQUIPMENT.]. This item does not have a nuclear hardened feature or any other critical feature such as tolerance, fit restriction or application. There is no data in the HMIRS and the NSN is in an FSC not generally suspected of containing hazardous materials. NSN 5998010329052 contains gold.
This NSN is associated to Schedule B 8542900000: electronic integrated circuits and microassembly parts. The Schedule B End Use is listed as semiconductors. NAICS classification category 334413: semiconductor and related device manufacturing.
This information was last updated on Jun 01, 2025.