National Stock Number
5998-01-270-1027
National Stock Number (NSN) 5998-01-270-1027, or NIIN 012701027, (circuit card assembly) was assigned December 29, 1987 in the Federal Logistics Information System (FLIS). This NIIN is Available for Manual Assignment. This NSN does not replace any other NSNs.
There are no manufacturer part numbers associated to this NSN.
This part number has not been procured by the US Government in over 5 years.
This NSN is assigned to Item Name Code (INC) 61638. [A GROUPING OF TWO OR MORE PHYSICALLY CONNECTED OR RELATED ELECTRICAL AN/OR ELECTRONIC PARTS CAPABLE OF DISSASSEMBLAGE. EACH COMPONENT OF THE ASSEMBLAGE MUST BE CAPABLE OF FUNCTIONING IN ACCORDANCE WITH ITS OWN ITEM NAME. CONSISTS OF A SINGLE PRINTED CIRCUIT BOARD OR TERMINAL BOARD UPON WHICH ARE MOUNTED SEPARATELY MANUFACTURED ELECTRONIC COMPONENTS SUCH AS CAPACITORS, INDUCTORS, RESISTORS, AND THE LIKE. IT MAY ALSO INCLUDE PRINTED ELECTRONIC COMPONENTS. THE ITEM IS GENERALLY PART OF A SUBASSEMBLY AND CANNOT BE ASSIGNED A MORE DEFINITE ITEM NAME. FOR ITEMS HAVING A COMPLETE INDIVIDUAL ELECTRICAL/ELECTRONIC FUNCTION, USE APPLICABLE ITEM NAME SUCH AS AMPLIFIER (AS MODIFIED); POWER SUPPLY; OR THE LIKE. FOR ITEMS NOT HAVING A COMPLETE INDIVIDUAL ELECTRICAL/ELECTRONIC FUNCTION, SEE APPLICABLE SUBASSEMBLY NAME, SUCH AS AMPLIFIER SUBASSEMBLY; POWER SUPPLY SUBASSEMBLY; OR THE LIKE. FOR AN ASSEMBLY OF ELECTRICAL/ELECTRONIC COMPONENTS MOUNTED ON OTHER THAN A SINGLE PRINTED WIRING BOARD, SEE ELECTRONIC COMPONENTS ASSEMBLY. EXCLUDES PRINTED CIRCUIT BOAR]. This item does not have a nuclear hardened feature or any other critical feature such as tolerance, fit restriction or application. There is no data in the HMIRS and the NSN is in an FSC not generally suspected of containing hazardous materials. NSN 5998012701027 contains an unknown precious metal.
This NSN is associated to Schedule B 8542900000: electronic integrated circuits and microassembly parts. The Schedule B End Use is listed as semiconductors. NAICS classification category 334413: semiconductor and related device manufacturing.
This information was last updated on Jul 01, 2025.