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NSN 5998-01-445-7068, 5998014457068
SHEET,PRINTED WIRING BOARD

Federal Supply Classification
FSC 5998 - Electrical and Electronic assemblies, Boards, Cards, and Associated Hardware
National Item Identification Number
NIIN 014457068
Codification Country
United States
Item Name Code
INC 38736
Criticality
(X) This item does not have a nuclear hardened feature or any other critical feature such as tolerance, fit restriction or application.
Hazardous Material Indicator Code
(N) There is no data in the HMIRS and the NSN is in an FSC not generally suspected of containing hazardous materials.
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DLMS® Summary

National Stock Number 5998-01-445-7068

National Stock Number (NSN) 5998-01-445-7068, or NIIN 014457068, (sheet,printed wiring board) was assigned June 10, 1997 in the Federal Logistics Information System (FLIS). This NIIN is Available for Manual Assignment. This NSN does not replace any other NSNs.

There are no manufacturer part numbers associated to this NSN.

This part number has not been procured by the US Government in over 5 years.

This NSN is assigned to Item Name Code (INC) 38736. [AN ELECTRICALLY INSULATED ITEM DESIGNED PRIMARILY TO BE USED FOR THE FABRICATION OF A PRINTED WIRING BOARD OR PRINTED CIRCUIT BOARD FOR ELECTRICAL AND ELECTRONIC CIRCUITS. IT MAY OR MAY NOT BE LAMINATED OR COPPER CLAD. FOR ITEMS WITH METAL CLADDING THE ELECTRICAL CONDUCTOR PATHS MUST BE CAPABLE OF BEING DEPOSITED, ETCHED, OR PRINTED IN VARIOUS PATTERNS. EXCLUDES:ITEMS HAVING PRINTED ELECTRONIC COMPONENTS, SUCH AS CAPACITORS, RESISTORS, AND THE LIKE. FOR ITEMS PROCESSED WITH ELECTRICAL CONDUCTIVE PATHS DEPOSITED, ETCHED, OR PRINTED IN VARIOUS PATTERNS, SEE PRINTED WIRING BOARD.]. This item does not have a nuclear hardened feature or any other critical feature such as tolerance, fit restriction or application. There is no data in the HMIRS and the NSN is in an FSC not generally suspected of containing hazardous materials. NSN 5998014457068 does not contain precious metals.

This NSN is associated to Schedule B 8542900000: electronic integrated circuits and microassembly parts. The Schedule B End Use is listed as semiconductors. NAICS classification category 334413: semiconductor and related device manufacturing.

This information was last updated on .


Technical Characteristics

SPECIAL FEATURES
(FEAT) BASE THICKNESS 2.112 IN; PLY THICKNESS 0.0030 IN; NOMINAL RESIN FLOW; 57 PCT RESIN CONTENT IN REINFORCEMENT; RESIN GEL TIME 120 SEC

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