National Stock Number
5998-01-457-0867
National Stock Number (NSN) 5998-01-457-0867, or NIIN 014570867, (holder,electrical card) was assigned July 10, 1998 in the Federal Logistics Information System (FLIS). This NIIN is Available for Manual Assignment. This NSN does not replace any other NSNs.
There are 2 manufacturer part numbers associated with this NSN. None of the associated part number(s) are considered obsolete. The manufacturer part numbers were originally supplied by 2 suppliers. Today, one supplier is listed as an Active supplier for this NSN. Of the active suppliers, only one supplier is deemed design controlled or valid supply parts.
This part number has not been procured by the US Government in over 5 years.
Based on a planned procurement review by the Primary Inventory Control Activity (PICA) on Aug 02, 2000, this NSN's acquisition method was noted as: Suitable for Competitive Acquisition. (Potential sources shall include dealers/distributors.) This part requires engineering source approval by the design control activity in order to maintain the quality of the part. An alternate source must qualify in accordance with the design control activity's procedures, as approved by the cognizant Government engineering activity. Valid AMCs: 1, 2, 3, 4 and 5.
This NSN is assigned to Item Name Code (INC) 31930. [A DEVICE SPECIFICALLY DESIGNED TO RETAIN CIRCUIT CARD ASSEMBLY OR PRINTED CIRCUIT BOARD IN THEIR INSTALLED POSITION. EXCLUDES, RETAINER-EJECTOR, ELECTRICAL CARD; AND HOLDER, PRINTED CIRCUIT BOARD.]. This item does not have a nuclear hardened feature or any other critical feature such as tolerance, fit restriction or application. There is no data in the HMIRS and the NSN is in an FSC not generally suspected of containing hazardous materials. NSN 5998014570867 does not contain precious metals.
This NSN is associated to Schedule B 8542900000: electronic integrated circuits and microassembly parts. The Schedule B End Use is listed as semiconductors. NAICS classification category 334413: semiconductor and related device manufacturing.
This information was last updated on Jun 01, 2024.