National Stock Number
5998-01-486-8592
National Stock Number (NSN) 5998-01-486-8592, or NIIN 014868592, (electronic components assembly) was assigned July 17, 2001 in the Federal Logistics Information System (FLIS). This NIIN is Available for Manual Assignment. This NSN does not replace any other NSNs.
There are 3 manufacturer part numbers associated with this NSN. One of those part number(s) are considered obsolete. The manufacturer part numbers were originally supplied by 2 suppliers. Today, 2 suppliers are listed as Active suppliers for this NSN. Of the active suppliers, only one supplier is deemed design controlled or valid supply parts.
This part number has not been procured by the US Government in over 5 years.
Based on a planned procurement review by the Primary Inventory Control Activity (PICA) on Sep 17, 2009, this NSN's acquisition method was noted as: Not established. Not established.
This NSN is assigned to Item Name Code (INC) 26088. [A GROUPING OF TWO OR MORE DIFFERENT TYPES OF ELECTRICAL/ELECTRONIC COMPONENTS MOUNTED ON A COMMON MOUNTING. IT MAY INCLUDE AN ASSEMBLY OF ELECTRICAL/ELECTRONIC COMPONENTS MOUNTED ON MULTIPLE PRINTED WIRING BOARD(S) MOUNTED BACK TO BACK, STACKED, AND THE LIKE. THE ITEM IS GENERALLY A COMPONENT OF A SUBASSEMBLY AND CANNOT BE ASSIGNED A MORE DEFINITE ITEM NAME. EXCLUDES ITEMS WHICH MAY BE IDENTIFIED AS A SUBASSEMBLY. FOR AN ASSEMBLY OF ELECTRICAL/ELECTRONIC COMPONENTS MOUNTED ON A SINGLE PRINTED WIRING BOARD, SEE CIRCUIT CARD ASSEEMBLY. DO NOT USE IF A MORE SPECIFIC NAME APPLIES.]. This item does not have a nuclear hardened feature but does have other critical feature(s) such as tolerance, fit restriction or application. There is no data in the HMIRS and the NSN is in an FSC not generally suspected of containing hazardous materials. NSN 5998014868592 does not contain precious metals.
This NSN is associated to Schedule B 8542900000: electronic integrated circuits and microassembly parts. The Schedule B End Use is listed as semiconductors. NAICS classification category 334413: semiconductor and related device manufacturing.
This information was last updated on Jul 01, 2025.