National Stock Number
5998-01-491-6896
National Stock Number (NSN) 5998-01-491-6896, or NIIN 014916896, (printed circuit board) was assigned October 29, 2001 in the Federal Logistics Information System (FLIS). This NIIN is Available for Manual Assignment. This NSN does not replace any other NSNs.
There is only one manufacturer part number associated with this NSN. None of the associated part number(s) are considered obsolete. The manufacturer part numbers were originally supplied by one supplier. Today, one supplier is listed as an Active supplier for this NSN. Of the active suppliers, only one supplier is deemed design controlled or valid supply parts.
This part number has not been procured by the US Government in over 5 years.
There has been very little demand for this national stock number. The demand for this NSN originated from less than 5 countries.
This NSN is assigned to Item Name Code (INC) 60843. [A PRINTED WIRING BOARD HAVING ONLY PRINTED ELECTRONIC COMPONENTS, SUCH AS CAPACITORS, RESISTORS, AND THE LIKE. FOR ITEMS HAVING A COMPLETE INDIVIDUAL ELECTRICAL/ELECTRONIC FUNCTION, USE APPLICABLE ITEM NAME, SUCH AS AMPLIFIER (AS MODIFIED); POWER SUPPLY; OR THE LIKE. FOR ITEMS NOT HAVING A COMPLETE INDIVIDUAL ELECTRICAL/ELECTRONIC FUNCTION, SEE APPLICABLE "SUBASSEMBLY" NAME, SUCH AS AMPLIFIER SUBASSEMBLY; POWER SUPPLY SUBASSEMBLY; OR THE LIKE. FOR ITEMS HAVING SEPARATELY MANUFACTURED COMPONENTS (OTHER THAN PLUG-IN CONNECTING FACILITIES) AND NOT HAVING A MORE SPECIFIC ITEM NAME, SEE CIRCUIT CARD ASSEMBLY.]. This item does not have a nuclear hardened feature or any other critical feature such as tolerance, fit restriction or application. There is no data in the HMIRS and the NSN is in an FSC not generally suspected of containing hazardous materials. NSN 5998014916896 does not contain precious metals.
This NSN is associated to Schedule B 8542900000: electronic integrated circuits and microassembly parts. The Schedule B End Use is listed as semiconductors. NAICS classification category 334413: semiconductor and related device manufacturing.
This information was last updated on Jun 01, 2024.