National Stock Number
5961-00-676-6297
National Stock Number (NSN) 5961-00-676-6297, or NIIN 006766297, (retainer,semiconductor device) was assigned January 1, 1963 in the Federal Logistics Information System (FLIS). This NIIN is Available for Manual Assignment. This NSN does not replace any other NSNs.
There is only one manufacturer part number associated with this NSN. None of the associated part number(s) are considered obsolete. The manufacturer part numbers were originally supplied by one supplier. Today, there are no suppliers listed as an Active supplier for this NSN. Of the active suppliers, there are no suppliers that are deemed design controlled or valid supply parts.
This part number has not been procured by the US Government in over 5 years.
This NSN is somewhat common among different platforms, belonging to 10 different weapons systems.
Based on a planned procurement review by the Primary Inventory Control Activity (PICA) on Aug 02, 2006, this NSN's acquisition method was noted as: Suitable for Competitive Acquisition. (Potential sources shall include dealers/distributors.) The Government has unlimited rights to the technical data, and the data package is complete. Valid AMCs: 1 and 2.
This NSN is assigned to Item Name Code (INC) 37244. [AN ITEM PRIMARILY DESIGNED TO POSITION AND/OR RESTRAIN THE MOVEMENT OF ONE OR MORE SEMICONDUCTOR DEVICES IN THEIR NORMAL OPERATING POSITION. EXCLUDES:CLIP (1), ELECTRICAL; CLAMP (1), LOOP; HOLDER, SEMICONDUCTOR DEVICE; HOLDER (1), CRYSTAL UNIT; RETAINER, CRYSTAL HOLDER; AND STRAP, RETAINING. SEE ALSO HEAT SINK, ELECTRICAL-ELECTRONIC COMPONENT AND SOCKET, PLUG-IN ELECTRONIC COMPONENTS.]. There is no data in the HMIRS and the NSN is in an FSC not generally suspected of containing hazardous materials. NSN 5961006766297 contains an unknown precious metal.
This NSN is associated to Schedule B 8541900000: diode, transistor & similar semiconductor device parts. The Schedule B End Use is listed as semiconductors. NAICS classification category 334413: semiconductor and related device manufacturing.
This information was last updated on Sep 01, 2024.